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Technology R & D Products
B.G.A Connector
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| This is a
test socket used during
the total inspection process
for the semi-conductor I.C
chip manufacturing processes.
The I.C chip is mounted
on this product and various
tests such as a high temperature
tolerance test and an electric
test to check if there are
any errors in the I.C chip.
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| No local product has been
developed. The purpose and
the design are the same
as those developed abroad. |
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| So far, JYSolutec
has successfully developed
up to the Q.F.P TYPE level
and plans to launch the
development of the C.B.D
TYPE. |
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The semi-conductor TEST
SOCKET was developed for
the first time in Korea.
The enhancement of the processing
precision level of the moulds
such as the existing connector
mould or semi-conductor
moulds is expected to follow.
In addition, based on these
technologies, the ffiber-optic
connector and even mould
for back-light as well as
semi-conductor connector
moulds, which were 100%
imported from the overseas
market, are expected to
be developed. |
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When the CORE thickness
is 0.200【0.0001, the ordinary
processing technology and a one-by-one
measurement is impossible to meet
the precise tolerance of 【0.0001
and to process it without bending
the CORE.
Thus, if the CORE is numbered
100, the total of 100 COREs before
the grinding processing is measured
first. The difference between
the total figure and the figure
after grinding is divided by the
quantity.
The remaining amount per unit
is processed in this technology.
Here, a total of 100 COREs (unit
figure of 0.200) is 20.000【0.005.
A grinding machine of high precision
with a special grinding stone,
specific grinding processing,
and the selection of suitable
materials is necessary. |
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The semi-conductor TEST
SOCKET was developed for
the first time in Korea.
The enhancement of the processing
precision level of the moulds
such as the existing connector
mould or semi-conductor
moulds is expected to follow.
In addition, based on these
technologies, the ffiber-optic
connector and even mould
for back-light as well as
semi-conductor connector
moulds, which were 100%
imported from the overseas
market, are expected to
be developed. |
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| This mould is assembled
in several COREs overlapped
and divided into many COREs.
The difference according
to CORE division line has
to be tolerated. Thus, suitable
grinding processing, electric
discharging technology,
suitable working conditions
for precision machines,
and working methods should
follow. |
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| The plastic (P.E.I) applied
to this technology should
keep higher temperature
(380~450∩) than the temperature
of the ordinary cylinder
(230~260∩) in order to consistently
obtain products. Thus, the
technology for temperature
control of the injection
cylinder, material drying
and injection technologies
are needed. |
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